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> 760 tiepoint solderless breadboard + 75 jumpwires
760 tiepoint solderless breadboard + 75 jumpwires
760 Tiepoint Solderless Breadboard
Breadboard Size 190 mm(L) x 47 mm(W) x 9 mm(H)
The Solderless Breadboard is an invaluable tool for the most demanding prototyping and design applications, whether in the R&D or University lab.
They allow electroniccomponents to be interconnected in an almost endless number of ways to produce working circuits.
Because no soldering is required, modifying or revising the circuits can be done quite easily, without the need for any tools and without the risk of overheating or damaging the board.
The breadboard consists of a set of formed metal sockets inserted into a durable plastic housing, holding them firmly in place. The breadboard pattern is a useful combination of isolated tie points, which serve as discrete points in the circuit,as well as a continuous bus structure, which serves to distribute power and provide common ground points.
SolderlessBreadboard - 760 Tie Points consists of : 650 Tie-Point Terminal Strip, 110 Tie-Point Distribution Strips.
