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Logitech vacuum wafer bonder BC3000


* Logitech 3 Station Vacuum bonder BC3000
* Bonds fragile materials such as silicon, GaAs, InP, glass or ceramic substrates.
* Can be used to mount whole or part wafers up to 4 in. dia.
Will produce consistently high standards of wafer to wafer support disk parallism.
* Operational when put in storage a few months ago
* Estiamted weight is 150 lbs



Logitech vacuum wafer bonder BC3000 Logitech vacuum wafer bonder BC3000 Logitech vacuum wafer bonder BC3000 Logitech vacuum wafer bonder BC3000