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5 disco diamond wafer dicing cut-off saw/blade rbt-1455
5 Disco Diamond Wafer Dicing Cut-Off Saw/Blade RBT-1455
NBC-ZH/ZHT series provides high productivity and excellent process results thanks to its superb cutting ability and long life.
DISCO's dicing blades are used with dicing and cutting saws to groove, cut, and dice silicon, compound semiconductors, glass, ceramics, crystals, and almost any other material.
Known for their strength and flexibility, Disco Abrasive Systems cut-off wheels are ideal for heavy, demanding cutting work. They have earned high praise for their performance in the cutting and grooving of metals and other materials.
The NBC-ZH/ZHT series is produced using DISCO's original technology. A combination of an ultra-thin diamond blade and an aluminum hub provides enhanced operation efficiency and stable cutting results. In combination with DISCO's vast application knowledge, these blades provide excellent cutting results when dicing silicon wafers and compound semiconductor wafers such as GaAs.
- 5 x Disco Diamond Cut-Off Wheel RBT-1455; Size 116.8mm x 0.3mm x 88.9mm
