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Disco diamond wafer dicing wheel/blade/saw nbc-zh-2050
BRAND NEW IN BOX (10 PCS/ 1 BOX) DISCO DIAMOND WAFER DICING CUT-OFF WHEEL/BLADE/SAW NBC-ZH-2050
The NBC-ZH series provides high productivity and excellent process results thanks to its superb cutting ability and long life.
The NBC-ZH series is produced using DISCO's original technology. A combination of an ultra-thin diamond blade and an aluminum hub provides enhanced operation efficiency and stable cutting results. In combination with DISCO's vast application knowledge, these blades provide excellent cutting results when dicing silicon wafers and compound semiconductor wafers such as GaAs.
* Advanced dicing process - bevel and step cutting
* Wide range of grit sizes and bond types to support various application requirements
* Shorter blade change time - increased productivity
* Environment-friendly PP (Polypropylene) packaging
Silicon, GaAS, GaP, LiTaO3, etc.
6000 Series and 600 Series fully automatic dicing saws
3000 Series, 300 Series, and 500 Series automatic dicing saws
For more information regarding the product, please visit: http://www.disco.co.jp/eg/products/catalog/pdf/nbc-zh.pdf
The units are Brand New in Box.
We have 100 Pcs / 10 Boxes available for sale.
Bulk discounts would be given, please drop us an email with the quantity you're interested for details.
